Title:
FLUX COMPOSITION, SOLDER COMPOSITION AND ELECTRONIC SUBSTRATE
Document Type and Number:
Japanese Patent JP2016030287
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a flux composition that, when formed into a solder composition, shows excellent storage stability and can sufficiently prevent the occurrence of solder balls.SOLUTION: A flux composition according to the present invention comprises (A) a rosin-based resin, (B) an activator, (C) a thixotropic agent, and (D) a solvent. The (B) component comprises (B1) a dicarboxylic acid having a divalent organic group with a ring structure. The divalent organic group with a ring structure in the (B1) component has 4-10 carbon atoms.SELECTED DRAWING: None
Inventors:
MATSUMURA MITSUHIRO
IWABUCHI MITSURU
ICHIKAWA DAIGO
IWABUCHI MITSURU
ICHIKAWA DAIGO
Application Number:
JP2014154621A
Publication Date:
March 07, 2016
Filing Date:
July 30, 2014
Export Citation:
Assignee:
TAMURA SEISAKUSHO KK
International Classes:
B23K35/363; H05K3/34
Domestic Patent References:
| JP2014117737A | 2014-06-30 | |||
| JP2014069194A | 2014-04-21 | |||
| JPH09253884A | 1997-09-30 | |||
| JP2002239785A | 2002-08-28 | |||
| JP2013082004A | 2013-05-09 |
Attorney, Agent or Firm:
Intellectual Property Office
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