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Title:
FOAM COMPOSITION AND DAMPING MATERIAL USING THE SAME
Document Type and Number:
Japanese Patent JP2002128854
Kind Code:
A
Abstract:

To provide a foam composition having a small viscosity variation during foaming and capable of obtaining a uniform foam without a delicate temperature control.

The foam composition comprises a mixture of at least a foaming agent, an active hydroxy group containing liquid polymer material which may be cured at a lower temperature than a decomposition temperature of the foaming agent, and a curing agent containing an isocyanate group, wherein an equivalent ratio (NCO/OH) of the isocyanato group of the curing agent and the active hydroxy group of the liquid polymer material is 1.5 or lower. The foam composition is mixed at a room temperature, heated after forming to the decomposition temperature of the foaming agent or higher, and foamed to obtain a foam.


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Inventors:
ITO SEIJI
OIGO TETSURO
Application Number:
JP2000323866A
Publication Date:
May 09, 2002
Filing Date:
October 24, 2000
Export Citation:
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Assignee:
SHOWA ELECTRIC WIRE & CABLE CO
International Classes:
F16F15/02; C08G18/40; C08G18/58; C08L75/04; C08L95/00; C09K3/00; C08G101/00; (IPC1-7): C08G18/40; C08G18/58; C08L75/04; C08L95/00; C09K3/00; F16F15/02
Attorney, Agent or Firm:
Kimiko Tada (1 person outside)