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Patent Searching and Data


Title:
FOAM MOLDED PRODUCT HAVING VOIDS
Document Type and Number:
Japanese Patent JP2006088439
Kind Code:
A
Abstract:

To provide a foam molded product having voids excellent in heat insulating properties, lightweight properties and sound absorbing properties and having enhanced chemical resistance and bending strength.

Styrene modified polyethylenic resin particles, which comprise a composition containing 300-1,000 pts.wt. of a styrenic resin component with respect to 100 pts.wt. of a polyethylenic resin component with a melting point of 95-115°C containing an inorganic nucleating agent and is set to a state that styrenic resin particles with a particle size of 0.8 μm or below are dispersed in the surface layers parts at least up to 5 μm from the surfaces of the particles, are impregnated with a volatile foaming agent to form foamable resin particles. The obtained foamable resin particles are subjected to foam molding to obtain the foam molded product having voids in a void ratio of 5-50%.


Inventors:
MATSUMURA HIDEO
MATSUGASHITA TATSUYA
Application Number:
JP2004275130A
Publication Date:
April 06, 2006
Filing Date:
September 22, 2004
Export Citation:
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Assignee:
SEKISUI PLASTICS
International Classes:
B29C44/00; C08J9/228; B29K23/00; B29K25/00; C08L23/04
Attorney, Agent or Firm:
Shintaro Nogawa