Title:
FORMATION OF BUMP ELECTRODE AND MANUFACTURE OF ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JPH10308416
Kind Code:
A
Abstract:
To form a bump electrode with sufficient joining strength even when wedge bonding is performed while using Pb, Sn, or In as principal components for adaption to any of a resin binder substrate, a ceramic substrate, etc.
On a pad electrode 2 of a substrate 1, a wedge bump 3 is formed by using a material which consists principally of one kind among Pb, Sn, and In and has 21 to 100 MPa tension strength. Wedge bonding temperature is preferably 10 to 70°C and heating temperature after the wedge bonding is 70 to 250°C. The pad electrode 2 consists principally of one kind among Ag, Pb, and Sn.
Inventors:
ARIKAWA TAKATOSHI
KOGASHIWA TOSHINORI
KIKUCHI TERUO
FUJIMOTO YUSUKE
KOGASHIWA TOSHINORI
KIKUCHI TERUO
FUJIMOTO YUSUKE
Application Number:
JP11380197A
Publication Date:
November 17, 1998
Filing Date:
May 01, 1997
Export Citation:
Assignee:
TANAKA ELECTRONICS IND
International Classes:
H01L21/60; H01L21/321; (IPC1-7): H01L21/60; H01L21/321
Attorney, Agent or Firm:
Masahaya Hayakawa (1 person outside)