PURPOSE: To eliminate the need for metallization by coating a resist for preventing calcination oxidation to part of a thin In film then calcining the same.

CONSTITUTION: The thin In film 2 is formed on a glass substrate 1 and is subjected to patterning to form an electrode pattern 3 of the thin In film for a display part and a wiring electrode pattern 4 of the thin In film for a driver packaging part. The resist 9 for preventing the calcination oxidation of the thin In film is coated on the pattern 4. The thin In film 3 is oxidized by a calcination stage to form transparent electrodes 5 of thin In2O3 film. On the other hand, the oxidation of the thin In film 4 is prevented by the resist 9 and the pattern 4 remains as it is when the resist 9 is removed. A driver LSI8 connecting to the pattern 4 of the driver packaging part is packaged on the substrate 1. The wiring pattern of low resistance is thus formed without the need for metallization.