Title:
FORMATION OF THIN FILM
Document Type and Number:
Japanese Patent JP2001084509
Kind Code:
A
Abstract:
To make it possible to uniformly form a metallic thin film by a lift-off method even when recessed parts are formed on a substrate.
A first resist layer 33 is formed in side grooves 32 formed on the substrate 21 and a resist material is packed therein to flaten the substrate 2, following which a second resist layer 34 is formed on the planarized substrate 21 and is exposed and developed, by which resist patterns of a reverse taper shape are formed and the metallic thin films 37 are formed. The resist patterns and the resist material in sides are dissolved away and the metallic thin films 37 on the resist patterns are removed, by which the metallic thin films 37 having prescribed patterns are formed.
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Inventors:
MONMA YUKA
SUZUKI KOJI
SUZUKI KOJI
Application Number:
JP25809699A
Publication Date:
March 30, 2001
Filing Date:
September 10, 1999
Export Citation:
Assignee:
SONY CORP
International Classes:
G11B5/127; G11B5/17; G11B5/23; (IPC1-7): G11B5/23
Attorney, Agent or Firm:
Akira Koike (2 outside)
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