To provide a forming method with which a reliable wiring (circuit) pattern can be formed while plating deposition on an unintended part is prevented in pattern formation of a wiring etc., using a drop discharge method and electroless plating, and to provide a wiring board formed with the same.

The forming method for the wiring pattern with the drop discharge method includes the steps of: forming an ink pattern by arranging ink containing a composition developing a function as a catalyst for electroless plating on a substrate with the drop discharge method; arranging a plating deposition disturbing composition on the substrate where the ink is not arranged; and depositing plating metal on the ink pattern by performing electroless plating processing on the substrate where the ink pattern and the plating deposition disturbing composition are arranged.