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Patent Searching and Data


Title:
FULLY-AUTOMATIC WAFER PROBER
Document Type and Number:
Japanese Patent JPH03209842
Kind Code:
A
Abstract:

PURPOSE: To make it possible to perform a test for a stable and high-quality probe by a method wherein a fully automatic wafer prober is provided with a contact pad capable of detecting the position of a probe contact part formed integrally with a stage.

CONSTITUTION: A stage positioning accuracy being possessed by a prober is utilized, a probe contact pad 4 formed integrally with a stage part 5 is provided, whether the pad 4 comes into contact with a probe 3 or not is electrically detected and the position of a probe contact part at the time of the detection is detected utilizing the mechanical accuracy of the stage. Accordingly, the shift in the horizontal direction and vertical direction of the probe 3 can be recognized and in respect to one beyond a specified region in the positional deviation of the probe at this time the impossibility of use of the probe can be informed an operator by a monitor, an alarm or the like. Thereby, a stable and high-quality probe card can be always used and a test for the stable and good probe can be performed.


Inventors:
OKANDA MASAO
Application Number:
JP480190A
Publication Date:
September 12, 1991
Filing Date:
January 12, 1990
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
G01R1/073; H01L21/66; G01R31/26; (IPC1-7): G01R1/073; G01R31/26; H01L21/66
Attorney, Agent or Firm:
Kisaburo Suzuki (1 outside)