Title:
FUNCTIONAL FILM PATTERN PROTECTION METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2015067463
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a functional film pattern protection method and a substrate processing device capable of sufficiently protecting a functional pattern formed on a substrate without damaging the same during a cutting treatment on the substrate.SOLUTION: A functional film pattern protection method comprises the steps of: forming a functional film pattern F at a predetermined position on a substrate surface B1; forming a surface treatment film X which covers the substrate surface B1 and the functional film pattern F; forming an etching-resistant protection film R on the surface treatment film X formed; cutting a substrate B by performing an etching treatment on a first region A on the surface B1 of the substrate B, the first region A being an area to be cut on the substrate B and the surface of the surface B1 being exposed after removing the protection film R and the surface treatment film X formed on the first region A; and washing and removing the surface treatment film X formed on second regions C, which are regions on the substrate B except the region A.
Inventors:
KOYAMA HIROTAKA
AOYAGI HITOSHI
HARA AKIRA
AOYAGI HITOSHI
HARA AKIRA
Application Number:
JP2013200814A
Publication Date:
April 13, 2015
Filing Date:
September 27, 2013
Export Citation:
Assignee:
SHIBAURA MECHATRONICS CORP
International Classes:
C03B32/02; C03C15/00; H05K3/28
Attorney, Agent or Firm:
Shinichi Ogawa
Fumihiko Nakahara
Fumihiko Nakahara
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