Title:
GAAS WAFER POLISHING SOLUTION AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH07241763
Kind Code:
A
Abstract:
PURPOSE: To provide a polishing solution having high polishing speed, and a polishing solution manufacturing method facilitating the control of the polishing solution.
CONSTITUTION: A GaAs wafer polishing solution manufactured by dissolving sodium dichloroisocyanurate, sodium tripolyphosphate, sodium carbonate, and sodium sulfate at need in separate distilled water to prepare solutions and mixing both solutions at the polishing time.
Inventors:
NAKAYAMA MOKICHI
Application Number:
JP3451194A
Publication Date:
September 19, 1995
Filing Date:
March 04, 1994
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
B24B37/00; C30B33/00; (IPC1-7): B24B37/00; C30B33/00
Attorney, Agent or Firm:
Akira Uchida (2 outside)
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