To provide a GaN substrate which can provide a larger number of nitride semiconductor elements.
An ingot 1 of a gallium nitride single crystal grown by a vapor-phase growth method is cut along specified planes S1, S2, and S3 to manufacture one or a plurality of single crystal gallium nitride substrates 7. The main surface of the single crystal gallium nitride substrate 7 is mirror-finished, and the main surface of the gallium nitride substrate 7 has a first region within 3 mm from the edge of the gallium nitride substrate 7, and a second region surrounded by the first region. The off angle formed by an axis crossing orthogonally with the main surface of the substrate and the C axis of the gallium nitride substrate takes the minimum value at a first point in the first region. The off angle formed by the axis crossing orthogonally with the main surface of the gallium nitride substrate 7 and the C axis of the gallium nitride substrate 7 is larger than zero over the second region of the main surface.
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Shiro Terasaki
Yoshiki Kuroki
Ichira Kondo