Title:
補助エンクロージャを利用するガスエンクロージャシステムおよび方法
Document Type and Number:
Japanese Patent JP6831046
Kind Code:
B2
Abstract:
A method, comprises: using a first handler located in a first transfer chamber operably coupled to an infeed end of a printing module, moving a substrate from a first load lock chamber to a first buffer chamber, the first buffer chamber configured to store a first plurality of substrates; using the first handler, moving one of the first plurality of substrates from the first buffer chamber to the printing module; while supporting the one of the first plurality of substrates using a gas bearing, conveying the one of the first plurality of substrates from the infeed end of the printing module to a location to be printed by a printhead assembly located in the printing module; and depositing, by the printhead assembly, a material onto a surface of the one of the first plurality of substrates.
Inventors:
Justin Mauck
Alexander So-Kang
Iliaf Bronsky
Chandon Alderson
Alexander So-Kang
Iliaf Bronsky
Chandon Alderson
Application Number:
JP2019000246A
Publication Date:
February 17, 2021
Filing Date:
January 04, 2019
Export Citation:
Assignee:
Cativa, Incorporated
International Classes:
H05B33/10; B05C5/00; H01L51/50
Domestic Patent References:
| JP2001223077A | ||||
| JP2006120382A | ||||
| JP2009175572A | ||||
| JP2004122112A | ||||
| JP2010267399A | ||||
| JP2004247111A |
Foreign References:
| US20130040061 | ||||
| WO2013023099A1 | ||||
| WO2008142966A1 |
Attorney, Agent or Firm:
Tamotsu Okato