Title:
GOLD PLATING BATH FOR TITANIUM AND TITANIUM ALLOY
Document Type and Number:
Japanese Patent JPS62247095
Kind Code:
A
Abstract:
PURPOSE:To improve the corrosion resistance and appearance of Ti or a Ti alloy by direct gold plating with satisfactory adhesion by using a gold plating bath contg. a fluorine compound at a specified concn. CONSTITUTION:This gold plating bath for Ti and Ti alloys contains 0.1-50g/l fluorine compound such as hydrofluoric acid. When the bath is used, an oxide film on the surface of Ti or a Ti alloy is removed during plating and gold plating having satisfactory adhesion, superior corrosion resistance and fine appearance is directly formed on the metal. The bath requires no special equipment and satisfactory plating can be carried out at a low cost.
Inventors:
KAWANABE MASAHARU
Application Number:
JP9157286A
Publication Date:
October 28, 1987
Filing Date:
April 21, 1986
Export Citation:
Assignee:
SEIKO INSTR & ELECTRONICS
International Classes:
C25D3/48; (IPC1-7): C25D3/48
Domestic Patent References:
| JPS52144335A | 1977-12-01 |
Attorney, Agent or Firm:
Keinosuke Hayashi (1 person outside)
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