Title:
GRINDING DEVICE
Document Type and Number:
Japanese Patent JP2021104552
Kind Code:
A
Abstract:
To shorten a time taken from replacement of a grindstone to start of grinding.SOLUTION: When grinding the first wafer after replacement of a grindstone, grinding means is caused to approach a holding surface of the wafer at a speed V2. When it was determined that a load value applied to the holding surface became larger than a specified load value G1 on this occasion, air cut and wafer grinding are performed at a first grinding speed V3 slower than the speed V2. Consequently, grinding of the first wafer W can be performed without performance of set-up for storing a height of the grinding means when an undersurface of the grindstone contacts the holding surface after replacement of the grindstone. Thus, grinding can be started immediately after replacement of the grindstone.SELECTED DRAWING: Figure 3
Inventors:
KUWANA KAZUTAKA
Application Number:
JP2019236194A
Publication Date:
July 26, 2021
Filing Date:
December 26, 2019
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B7/04; B24B49/16; B24B49/02; B24B49/10; H01L21/304
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office