To provide a grinding device for grinding a workpiece by a grinding wheel whose flexible members are mixed with abrasives in order to make its thickness uniform.
This grinding device is provided with a chuck table mechanism having a chuck table 52 equipped with a holding face 522a for holding a workpiece and a driving means for driving the rotation of the chuck table, a grinding unit having a grinding wheel whose flexible members are mixed with abrasives for grinding the workpiece held on the holding face of the chuck table and a driving means for driving the rotation of the grinding wheel and a grinding unit feeding mechanism for moving back and forth the grinding unit perpendicular to the holding face of the chuck table. The holding face of the chuck table is formed as a spherical surface-shaped recess curved surface.
WO/2022/196631 | POLISHING HEAD, AND POLISHING TREATMENT DEVICE |
JP6649933 | Wafer holder for grinding machine |
JPS6377651 | PRODUCTION OF MAGNETIC HEAD |
HAYAKAWA SUSUMU
Sachiko Okunuki
Next Patent: CORRECTION METHOD AND DEVICE FOR HOLE CLOGGING FOR PRINTED WIRING BOARD AND MANUFACTURING METHOD OF ...