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Title:
GRINDING PROCESSING METHOD AND GRINDING PROCESSING DEVICE OF FORMING DIE OF MICRO LENS ARRAY
Document Type and Number:
Japanese Patent JP2006289566
Kind Code:
A
Abstract:

To highly accurately and uniformly grind and process a recessed part of a spherical shape having a predetermined radius of curvature and surface accuracy on a molding surface.

This grinding processing device has a main spindle 7 for installing a work, a grinding spindle 9 slantingly arrangeable to the main spindle 7, a grinding wheel 13 installed on the grinding spindle 9, a grinding spindle holder 12 for substantially integrally revolving and moving the grinding wheel 13 with the work in a state of setting a distance between the main spindle 7 and the processing center of the work substantially constant by pushing the grinding wheel 13 against the work, and a sensor 35 for measuring dimensional accuracy of the processed recessed part of the spherical shape. An inclination of the grinding spindle 9 is corrected by feeding back a measuring result by the sensor 35 to a rotary table 10 via a control part 36.


Inventors:
CHIAKI SHUNJI
Application Number:
JP2005115250A
Publication Date:
October 26, 2006
Filing Date:
April 13, 2005
Export Citation:
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Assignee:
OLYMPUS CORP
International Classes:
B24B13/00
Attorney, Agent or Firm:
Yoshiyuki Osuga