Title:
HALF WAVELENGTH SIDE COUPLING FILTER
Document Type and Number:
Japanese Patent JPH04294601
Kind Code:
A
Abstract:
PURPOSE: To easily adjust the characteristic such as a characteristic impedance and the degree of coupling.
CONSTITUTION: Metallic wires 3a-3c by Schottky coupling are provided on the upper face of a semiconductor active layer to form the microstrip lines 5a-5c of half wavelength side coupling structure. The spread of depletion layers 6a-6c under the metallic wires 3a-3c is changed by adjusting DC bias voltages Vb1-Vb3 applied to the metallic wires 3a-3c to adjust the characteristic impedance and the degree of coupling.
Inventors:
NAKANO HIROYUKI
SAKAMOTO KOICHI
SAKAMOTO KOICHI
Application Number:
JP8348591A
Publication Date:
October 19, 1992
Filing Date:
March 22, 1991
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H01L29/80; H01P1/203; H01P3/08; H01P5/02; (IPC1-7): H01L29/804; H01P1/203; H01P3/08
Attorney, Agent or Firm:
Nakano Masafusa