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Patent Searching and Data


Title:
HARNESS MOLDING DEVICE AND HARNESS MOLDING METHOD
Document Type and Number:
Japanese Patent JP2006351213
Kind Code:
A
Abstract:

To reduce the cost of molding dies and a space occupied by the molding dies and to simply set a wire harness to the molding dies.

This harness molding device is provided with the molding dies 2 and 3 where a plurality of wire insertion parts 4 are formed in parallel with one another by piercing them; a partitioned armor formation part 14 is formed in each wire insertion part; wire parts 17 of a wire harness 19 are inserted into the respective wire insertion parts in parallel with one another; and exterior parts 9 are formed by injecting a resin material into the respective exterior formation parts. Branch wire insertion parts 18 are formed by intercrossing them with the wire insertion parts 4 on the outer ends; and exterior formation parts 15 are formed in the branch wire insertion parts. Sealing barriers 12 are movably formed in the exterior formation parts and exterior parts 9 and 10 are formed in the barriers. Wire supporting projection part 36 and 37 are formed in the exterior formation parts and circumferential bending slits 38 are formed in the exterior parts by the projection parts.


Inventors:
MASUNARI SHOJI
DAITO KOJI
Application Number:
JP2005171933A
Publication Date:
December 28, 2006
Filing Date:
June 13, 2005
Export Citation:
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Assignee:
YAZAKI CORP
International Classes:
H01B13/012; B29C33/12; B29C45/14; B29L31/36
Domestic Patent References:
JP2004006113A2004-01-08
JPS6419621A1989-01-23
JP2003317555A2003-11-07
JPS63313421A1988-12-21
JPH10649A1998-01-06
JPS61183816A1986-08-16
JP2006127790A2006-05-18
Attorney, Agent or Firm:
Hideo Takino
Hiroshi Ochi
Sadao Matsumura
Isamu Kakiuchi