Title:
ヘッドスライダ支持装置、ディスク装置及びサスペンション
Document Type and Number:
Japanese Patent JP3992821
Kind Code:
B2
Abstract:
A suspension has a head slider loading prearranged portion on which a head slider integrally having a head is loaded, a head IC chip mounting prearranged portion on which a head IC chip is mounted, and wiring patterns which extend from the head slider loading prearranged portion. The head slider is loaded and supported on the head slider loading prearranged portion of the suspension. The head IC chip is mounted on the head IC chip mounting prearranged portion of the suspension. The head IC chip mounting prearranged portion includes through holes formed in the suspension and head IC chip mounting terminals on a surface of the suspension, which surface is opposite to a surface on which the head slider loading prearranged portion is provided, the terminals being electrically connected with the extending ends of said wiring patterns via the through holes, the terminals being provided in an arrangement corresponding to terminals of the head IC chip. The head IC chip is mounted on the surface of the suspension, which surface is opposite to the surface on which the head slider is loaded.
Inventors:
Hiraoka Shinji
Application Number:
JP7288198A
Publication Date:
October 17, 2007
Filing Date:
March 20, 1998
Export Citation:
Assignee:
富士通株式会社
International Classes:
G11B5/60; G11B5/48; G11B21/21
Domestic Patent References:
| JP3272015A | ||||
| JP1113820U | ||||
| JP63204508A | ||||
| JP9092943A | ||||
| JP9148704A | ||||
| JP4134611A | ||||
| JP7235156A | ||||
| JP9106521A | ||||
| JP7182643A | ||||
| JP11213364A | ||||
| JP6168573A |
Foreign References:
| WO1997035310A1 |
Attorney, Agent or Firm:
Tadahiko Ito