To provide a heat conducting base board hardly influenced by noises, to provide a manufacturing method thereof, to provide a power supply unit, and to provide electronic equipment.
The heat conducting base board is provided with metal plates 17 each having one or more holes 22; a sheet-like heat transfer resin layer 11 fixed on the metal plates 17; lead frames 10 buried in the heat transfer resin layer 11 and floating islands 12, a heat radiation substrate having the lead frames 10 and the floating islands 12 being a front surface side; and a printed wiring board having a control section provided on the holes of the metal plates 17. A power circuit section is electrically connected to a control section via a bent portion 13 formed on the lead frames 10 and the floating islands 12. A wiring length between each of power elements 14 mounted on the lead frames 10 and each of control elements 16 for controlling the power element 14 is formed short to suppress the influence of noises due to the power elements 14. Thus, high performance of a power supply unit, various kinds of electronic equipment and cost reduction can be achieved.
TSUMURA TETSUYA
NISHIYAMA KIMIHARU
| JP2003347705A | 2003-12-05 | |||
| JP2001308250A | 2001-11-02 | |||
| JP2005252018A | 2005-09-15 | |||
| JP2001053412A | 2001-02-23 |
Hiroki Naito
Daisuke Nagano
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