HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEETS AND FIXING MEHTOD OF ELECTRONIC PARTS TO COOLING PARTS USING THE SAME

Title:

HEAT-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEETS AND FIXING MEHTOD OF ELECTRONIC PARTS TO COOLING PARTS USING THE SAME

Document Type and Number:

Japanese Patent JPH10292157

Kind Code:

A

Abstract:

To obtain adhesive sheets that can manifest excellent adhesion between a substrate and an adhesive layer and excellent heat resistance by forming a specifically constituted thermo-conductive pressure-sensitive adhesive composition on a specifically treated specific plastic film.

These sheets are produced by forming a thermo-conductive pressure-sensitive adhesive composition containing a hydrophilic group-bearing (meth)acrylic alkyl ester polymer on the high-frequency sputtering etched plastic film filled with a thermo-conductive and electrically insulating filler in an amount of 2-50 vol% and is given in the form of sheets or tapes. In a preferred embodiment, the plastic film is polyimdie or polyamide film. Boron nitride or alumina is used as the thermally conductive and electrically insulating filler. This sheet can be expected for the fixation of electronic parts to radiating parts or to building parts.

Inventors:

OURA MASAHIRO
KITAKURA KAZUYUKI
MUTA SHIGEKI
YOSHIKAWA TAKAO

Application Number:

JP9988397A

Publication Date:

November 04, 1998

Filing Date:

April 17, 1997

Export Citation:

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Assignee:

NITTO DENKO CORP

International Classes:

B32B7/12; C09J5/00; C09J7/22; C09J7/38; C09J133/06; H01L21/58; H01L23/373; C08L79/08; (IPC1-7): C09J7/02; B32B7/12; C09J5/00; C09J133/06

Attorney, Agent or Firm:

Ogi

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