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Patent Searching and Data


Title:
HEAT CONDUCTIVE SILICONE RUBBER COMPOSITION AND ITS PRODUCING METHOD
Document Type and Number:
Japanese Patent JP2002038012
Kind Code:
A
Abstract:

To provide a heat conductive silicone rubber composition resulting in a silicone rubber molding having an excellent filtering property upon its production, a small compression permanent set, and excellent heat conductivity.

A producing method of the heat conductive silicone rubber composition comprising (A) 100 pts.wt. of an organopolysiloxane raw rubber represented by the average unit formula: RaSiO(4-a)/2 (wherein R is a monovalent hydrocarbon group which may be substituted with halogen, and a is a number of 1.8-2.3), (B) 10-500 pts.wt. of an alumina powder having an average particle diameter of 1-10 μm and a particle size of 0.5-20 μm in the powder of ≥70 wt.%, and (C) a curing agent, comprises mixing the components (A) and (B), passing the mixture through a wire fabric in filtering equipment, removing foreign matter to produce a silicone rubber base compound, and then mixing the curing agent (C) with the compound.


Inventors:
MIYAZAKI YOSHIAKI
HASEGAWA TOMOICHIROU
TOKIMATSU JUNSUKE
MATSUSHITA TAKAO
Application Number:
JP2000228026A
Publication Date:
February 06, 2002
Filing Date:
July 28, 2000
Export Citation:
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Assignee:
DOW CORNING TORAY SILICONE
International Classes:
C08K3/22; C08L83/04; C08L83/05; C09K5/08; F16C13/00; (IPC1-7): C08L83/04; C08K3/22; C08L83/05; C09K5/08; F16C13/00