Title:
HEAT-DISSIPATING STRUCTURE OF PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP3890639
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To accomplish high density mounting, and to provide the heat-radiating structure of a light weight printed wiring board, having superior heat-radiating property.
SOLUTION: A printed wiring board 7 is provided with a mounting pad 111 to be used for soldering an electronic part 3, an internal heat transfer layer 13 provided inside a substrate, a via-hole 121 with which the mounting pad and the internal heat transfer layer are connected, and an auxiliary heat transfer layer 131 provided inside the substrate facing the internal heat transfer layer, and the printed wiring board 7 is fixed to an instrumental housing by a metal fixing means 14 which penetrates the substrate. A surface heat transfer layer 112, which is connected to the metal fixing means 14, and a heat transfer hole 122, with which a surface heat transfer layer 13 and an auxiliary heat transfer layer 131 are connected, are provided in the printed wiring board 7. The heat generated by the electronic part is dissipated to the instrumental housing through the mounting pad, the via-hole, the internal heat transfer layer, the auxiliary heat transfer layer, the heat transfer hole, the surface heat transfer layer and the metal fixing means.
More Like This:
Inventors:
Yoshio Kawade
Takahiro Yamashita
Takahiro Yamashita
Application Number:
JP26556396A
Publication Date:
March 07, 2007
Filing Date:
September 13, 1996
Export Citation:
Assignee:
IBIDEN CO.,LTD.
International Classes:
H05K3/46; H05K7/20; (IPC1-7): H05K3/46; H05K7/20
Domestic Patent References:
| JP8505013A | ||||
| JP7297506A | ||||
| JP537094A | ||||
| JP677679A | ||||
| JP2155288A | ||||
| JP6331575U |
Attorney, Agent or Firm:
Yoshiyasu Takahashi
Previous Patent: IMAGE INFORMATION CONVERTER AND ITS METHOD
Next Patent: COMMERCIAL FILM TRANSMITTING SYSTEM
Next Patent: COMMERCIAL FILM TRANSMITTING SYSTEM