Title:
放熱装置
Document Type and Number:
Japanese Patent JP7213687
Kind Code:
B2
Abstract:
Provided is a heat radiation device that can achieve high heat radiation. A heat radiation device comprises: a heat generator; a heat radiator; and a heat conductive sheet attached in a sandwiched manner between the heat generator and the heat radiator, wherein a heat conductivity of the heat conductive sheet in a thickness direction is 15 W/m·K or more, and an area of a sandwiched surface of the heat conductive sheet is smaller than an area of an attached surface of the heat generator and the heat radiator.
Inventors:
Kobayashi Gen
Yasuyuki Murakami
Daisuke Utsumi
Yasuyuki Murakami
Daisuke Utsumi
Application Number:
JP2018524959A
Publication Date:
January 27, 2023
Filing Date:
May 24, 2017
Export Citation:
Assignee:
Zeon Corporation
International Classes:
H01L23/36; C08K3/04; C08L101/00; H05K7/20
Domestic Patent References:
| JP2004111370A | ||||
| JP200144673A | ||||
| JP2010132856A | ||||
| JP2011162642A | ||||
| JP2003158393A |
Attorney, Agent or Firm:
Kenji Sugimura
Mitsutsugu Sugimura
Yuta Terashima
Noboru Hiro
Mitsutsugu Sugimura
Yuta Terashima
Noboru Hiro
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