Title:
HEAT DISSIPATION PLATE FOR REDUCING NOISE
Document Type and Number:
Japanese Patent JPH01150396
Kind Code:
A
Abstract:
PURPOSE:To contrive the stabilization of a ground potential and a reduction in noise by a method wherein a heating element is installed on a printed circuit board and with the heat dissipation of the element executed, the element is screwed on a chassis to obtain common electrical ground points. CONSTITUTION:Transistors 1 and 2 are mounted to a heat dissipation plate 3 and the plate 3 is fixed on a main body printed circuit board by screws. Part of a resist is removed at ground points and by screwing the plate 3 on the side of a pattern or on the side of a component surface, the ground points become equipotential to one another through the plate 3. According to this plate 3, several places of the ground points can be made in common and both the need for taking the pattern widely and the need of such additional components as a vinyl jumper are eliminated. Thereby, the stabilization of a ground potential and a reduction in noise can be contrived.
Inventors:
FUKUTANI JUNICHI
Application Number:
JP30878587A
Publication Date:
June 13, 1989
Filing Date:
December 08, 1987
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L23/40; H01R4/64; H05K7/20; H05K9/00; (IPC1-7): H01L23/40; H01R4/64; H05K7/20; H05K9/00
Attorney, Agent or Firm:
Tsuneji Hoshino (1 outside)
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