PURPOSE: To improve heat dissipation and to realize freedom of design and simplification of manufacture by dissipating heat of a semiconductor dispersing to a conductor layer which is conducted and connected thereto and by adjusting the number of layers.
CONSTITUTION: Heat generated from a semiconductor 5 is conducted from a conductor layer 1 at a bottom part of a semiconductor mount part 4 to each of other conductor layers 1 provided to a package substrate 3 through a through-hole 6. Thereby, the heat is dissipated to the outside of a package from a surface of the package substrate 3 after dispersed all over the package substrate 3 as shown by an arrow. Furthermore, it is possible to design heat dissipation performance by adjusting the number of layers of the conductor layer 1 and to acquire effective heat dissipation performance by increasing the number of layers.
ARAI HITOSHI
MAEDA AKITSUGU
KANO TAKESHI
HIGUCHI TORU
| JPS549767A | 1979-01-24 |