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Title:
HEAT EXCHANGER TUBE FOR FLOW DOWN LIQUID FILM TYPE EVAPORATOR
Document Type and Number:
Japanese Patent JP2002277104
Kind Code:
A
Abstract:

To provide a heat exchanger tube for flow down liquid film type evaporator exhibiting good durability in which good wet spread performance of refrigerant is realized while preventing refrigerant from standing on the lower surface.

The heat exchanger tube 11a comprises a copper tube 12 made of copper or a copper alloy, and a hydrophilic film 13 is formed on the outer circumferential surface of the copper tube 12. A region 5a on the outer circumferential surface of the copper tube 12 where the film 13 is formed comprises a plurality of stripe regions extending along the axial direction of tube and arranged along the circumferential direction of tube at a substantially constant interval. The rate of projection area of the region 5a to that of the outer circumferential surface of the copper tube 12 is set in the range of 30-98%. The film 13 is a two-layered film comprising a lower layer film principally comprising alumina and silica and an upper layer film principally comprising silicate and phosphate or its derivative and has a thickness in the range of 0.1-10 μm.


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Inventors:
HOSOKI TETSUO
TADA YOSHIO
TSUCHIYA AKINORI
SAEKI CHIKARA
Application Number:
JP2001076889A
Publication Date:
September 25, 2002
Filing Date:
March 16, 2001
Export Citation:
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Assignee:
KOBE STEEL LTD
International Classes:
F25B39/02; F28F13/18; (IPC1-7): F25B39/02; F28F13/18
Attorney, Agent or Firm:
Masanori Fujimaki



 
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