Title:
HEAT INSULATING AND HEAT SHIELDING, OR HEAT RESERVING PANEL
Document Type and Number:
Japanese Patent JP3851595
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To facilitate heat insulation and heat shielding or heat reserving in carpentry of a building.
SOLUTION: There is provided a heat insulating foam board having a suitable thickness and a suitable length. Both or one of upper and lower surfaces of the foam board has an aluminum sheet or an aluminum foil 2 fixed thereto by sticking or the like. The aluminum sheet or the aluminum foil 2 has large surplus folded portions 2', 2', 2" relative to the upper surface area of the board 1, and the mutually adjacent foam boards allow their surplus folded portions to be superposed on each other on an upper surface of a rafter 3.
Inventors:
Hidehiro Watanabe
Application Number:
JP2002195613A
Publication Date:
November 29, 2006
Filing Date:
July 04, 2002
Export Citation:
Assignee:
Kita Kei Co., Ltd.
International Classes:
E04B1/76; E04B1/80; B32B5/18; B32B15/08; B32B15/082; E04C2/20; (IPC1-7): E04B1/80; B32B5/18; B32B15/08; E04C2/20
Domestic Patent References:
| JP11029998A | ||||
| JP2000204689A | ||||
| JP2001032398A |
Attorney, Agent or Firm:
Takashi Hatakeyama
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