PURPOSE: To manufacture a heat pipe low in thermal resistance by performing eutectic alloy brazing between wick materials, and the wick materials and the inner wall of a container by using a metal different from a ground metal.

CONSTITUTION: A silver adhesion layer 4 of about 2W3μm thickness is formed on the surface of wicks 2 made of oxygen-free copper grains and on the surface of an oxygen-free copper container 1 on which the wicks 2 are adhered by plating, vapor deposition, etc. By treating this in a furnace of reducing atmosphere at about 900°C, Silver is diffused on the surface of oxygen-free copper, and eutectic alloy layers with silver are formed on the surface of copper grains. Thus, it becomes a sintered wick structure having intervening silver, high in porosity, high in heat conductivity to the container material 1, and a highly efficient heat pipe is obtained.