To provide a heat-pump hot-water supply device capable of efficiently heating water by thermally insulating peripheral spaces of a compressor and a refrigerant pipe without increasing manufacturing cost and the size of a device.
This heat-pump hot-water supply device comprises a compressor storage part 111 which is formed of a partition plate 27 and a casing external plate 32 forming an air blow circuit for blowing air to an evaporator 24 and in which a compressor 21 is disposed and a refrigerating cycle component insulating part 113 formed by surrounding at least the compressor 21 by insulators 41, 43. The insulator 43 forming one surface of the refrigerating cycle component insulating part 113 is brought into contact with the partition plate 27 or the external plate 32. The same member 43 as the insulator 43 in contact with the partition plate 27 or the casing external plate 32 or a member extending from the insulator forms the other surface of the refrigerating cycle component insulating part 113.
YAMAOKA YOSHIKI
ISAYAMA YASUHIKO
FUJITAKA AKIRA
| JPH04171281A | 1992-06-18 | |||
| JP2007192440A | 2007-08-02 | |||
| JPH0359334A | 1991-03-14 | |||
| JP2000088294A | 2000-03-31 | |||
| JP2005221088A | 2005-08-18 |
Hiroki Naito
Daisuke Nagano