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Title:
HEAT RADIATION STRUCTURE FOR LIGHT EMITTING DIODE LAMP
Document Type and Number:
Japanese Patent JP2000149151
Kind Code:
A
Abstract:

To effectively radiate heat emitted by LED from a lamp body and a globe through a filling material and a supporting main body since a part of the supporting main body is made in close contact with the lamp body and the globe, to improve light emitting efficiency since the temperature rising in LED can be prevented and to improve the radiation luminous intensity of a lamp unit.

This heat radiation structure has an LED 1, a substrate 2, a supporting main body 3, a filling material 4 and a glove 5. The lead part of LED is soldered to the conduction pattern of the substrate 2. The supporting main body 3 is the good conductor of heat and it supports the substrate 2 between the lead part and solder through the thermally conductive and non- electrically conductive filling material 4 and radiates heat from a flange part 11. The globe covers LED 1 by leaving the heat radiation face of the supporting main body 3.


Inventors:
NAKAMURA KOYO
TOIDA SHUNJI
Application Number:
JP32038698A
Publication Date:
May 30, 2000
Filing Date:
November 11, 1998
Export Citation:
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Assignee:
NIPPON KOKI KOGYO KK
International Classes:
G08B5/36; F21V29/00; H01L33/00; F21Y101/00; (IPC1-7): G08B5/36; F21V29/00; H01L33/00
Attorney, Agent or Firm:
Nakamura



 
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