Title:
HEAT-RESISTANT ADHESIVE
Document Type and Number:
Japanese Patent JP3034144
Kind Code:
B2
Abstract:
PURPOSE: To obtain an adhesive excellent in adhesive power, heat resistance, etc., by compounding a specific polyamic acid mixture derived from three diamines with a specified amt. of a specific bismaleimide compd.
CONSTITUTION: A mixture comprising 5-40mol% arom. diamine of formula I (wherein X1 is a single bond, a 1-10C divalent hydrocarbon group, a hexafluorinated isopropylidene group, a carbonyl group, etc.), 10-60mol% arom. diamine of formula II (wherein X2 is the same as X1), and 20-80mol% arom. diamine of formula III is polymerized with a tetracarboxylic dianhydride of formula IV (wherein Y is a tetravalent, 2C or higher aliph., alicyclic, or arom. group) in an org. solvent to give a polyamic acid mixture. 100 pts.wt. the polyamic acid mixture is compounded with 0.1-5 pts.wt. bismaleimide compd. of formula V (wherein R is a group of formula VI or VII; and Z is the same as X1) to give a heat-resistant adhesive.
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Inventors:
Akio Matsuyama
Osamu Takago
Masahiro Ohta
Osamu Takago
Masahiro Ohta
Application Number:
JP34255192A
Publication Date:
April 17, 2000
Filing Date:
December 22, 1992
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
C08G73/10; C09J179/08; (IPC1-7): C09J179/08; C08G73/10
Domestic Patent References:
| JP3205474A | ||||
| JP62235382A | ||||
| JP62235383A | ||||
| JP2138788A | ||||
| JP61143478A |