PURPOSE: To obtain the titled composition, consisting of a specific aromatic diamine and epoxy resin, having improved operability, heat resistance, e.g. heat distortion temperature, mechanical strength at high temperatures, etc., of molded articles and suitable for laminated boards, printed circuit boards, molded articles, etc.

CONSTITUTION: A composition consisting of (A) an aromatic diamine expressed by the formula (R1 and R2 are lower alkyl), e.g. 2,2-bis(4-amino-3,5- dimethylphenyl)propane, 2,2-bis(4-amino-3-methyl-5-ethylphenyl)propane, etc., and (B) an epoxy resin. The amount of the component (A) used is preferably 0.8W1.2 active hydrogen equivalents based on 1 equivalent component (B).