PURPOSE: To obtain a heat-resistant film adhesive, excellent in low-temperature processability, bonding operation efficiency and reliability and useful for electron ics, etc., by flow-casting a solution of a specific heat-resistant resin composition onto the surface of a support.

CONSTITUTION: This heat-resistant film adhesive contains (A) 100 pts.wt. polyimide resin, soluble in organic solvents, having ≤350°C glass transition temperature and comprising a main acid component of 4,4'-oxydiphthalic dianhydride and a main amine component of a diaminoslloxane compound of the formula [R1 and R2 are each a bivalent 1-4C aliphatic or aromatic group; R3 to R6 are each a monovalent aliphatic or aromatic group; (k) is 1-20] such as α, ω-bis(3- aminopropyl)polydimethylsiloxane and 1,3-bis(3-aminophenoxy)benzene, (B) 5-100 pts.wt. epoxy compound having ≥2 epoxy groups in one molecule and (C) 0.1-50 pts.wt. coupling agent such as a silane coupling agent as principal components. Furthermore, the method for producing the heat-resistant film adhesive is to flow-cast a solution of a heat-resistant resin composition containing the components (A), (B) and (C) onto one or both surfaces of a support.