To obtain a film freed from gels and wrinkles and having good transparency and openability and excellent heat resistance by molding a composition prepared by mixing a specified polyamide resin mixture with a copper halide compound and an inorganic filler.

This film is obtained by molding a polyamide resin mixture prepared by mixing 100 pts.wt. polyamide resin mixture (A) comprising 65-95 pts.wt. nylon 66 and 35-5 pts.wt. nylon 6 with 0.005-0.05 pts.wt. (in terms of copper) copper halide compound (B) and 0.05-0.5 pts.wt. inorganic filler (C). Although nylon 66 has a high melting point and excellent mechanical properties, gas-barrier properties, etc., and therefore extensively used as a material for various packaging films which is required to have heat resistance, the obtained films have a drawback that they have gel spots resulting from gelation due to thermal deterioration and wrinkles. By using the material prepared by using a mixture of nylon 66 with nylon 6 in the above ratio, the resulting mixture is applicable to inflation processes and can give the above film at a low cost.