Title:
HEAT-RESISTANT RESIN BINDER SHEET AND SUBSTRATE
Document Type and Number:
Japanese Patent JP3031322
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain the subject sheet capable of comfortably bonding a heat- resistant film to a metallic foil and having a low softening temperature by providing a thin film of a specific heat-resistant binder on one face of a heat- resistant film.
SOLUTION: This binder sheet is obtained by forming a thin film of an uncured heat-resistant resin binder from which a solvent is removed, obtained after coating and drying a solution composition containing (A) a soluble polyimidesiloxane comprising an aromatic tetracarboxylic acid, diaminopolysiloxane and an aromatic diamine and having ≤250kg/mm2 elastic modulus when made to a film, (B) an epoxy resin and (C) a phenolic OH- containing resin hardener as soluble resin components, on one face of a heat- resistant film. Furthermore, an etched film exhibiting a curling property of a circuit board after removing a copper foil on a coppered substrate obtained by adhering a copper foil to a polyimide film with the binder and heat-curing exhibits ≥100mm flexibility designated by radius of curvature, and heat resistance of the coppered substrate designated by adhering strength at 180°C is ≥0.6kg/mm2.
Inventors:
Hiroshi Inoue
Seiichiro Takabayashi
Tadao Muramatsu
Tsutomu Funakoshi
Kenji Sonoyama
Seiichiro Takabayashi
Tadao Muramatsu
Tsutomu Funakoshi
Kenji Sonoyama
Application Number:
JP35071597A
Publication Date:
April 10, 2000
Filing Date:
December 19, 1997
Export Citation:
Assignee:
Ube Industries,Ltd.
International Classes:
C08L63/00; C08G77/455; C08L79/08; C09J7/02; C09J163/00; C09J179/08; H01L21/60; H05K1/03; (IPC1-7): C09J7/02; C09J163/00; C09J179/08; H01L21/60; H05K1/03
Domestic Patent References:
| JP525453A | ||||
| JP2158681A | ||||
| JP1121325A | ||||
| JP60130666A |