Title:
耐熱性樹脂組成物、これを用いた接着フィルム及び接着層付ポリイミドフィルム
Document Type and Number:
Japanese Patent JP4378577
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a resin composition excellent in adhesiveness and heat resistance by including a siloxane-modified polyamide imide resin with a rubbery elastomer, and a thermosetting resin. SOLUTION: This composition contains 100 pts.wt. (A) siloxane-modified polyamide imide resin, 5-20 pts.wt. (B) rubbery elastomer such as an acrylonitrile rubber, 10-150 pts.wt. (C) thermosetting resin such as an epoxy resin, and a phosphorus compound such as triphenylphosphine and an inorganic filler such as aluminum hydroxide in amounts of 5-25 pts.wt. and 50-80 pts.wt. per 100 pts.wt. total of components A, B, and C. Component A is obtained by reacting a mixture containing diimidedicarboxylic acids represented by formulae I and II and obtained by reacting a mixture of a diamine having at least three aromatic rings with a siloxanediamine with trimellitic anhydride with an aromatic diisocyanate represented by the formula: OCN-R9-OCN. In the formula, R1 is a group of formula III; R2 is a group of formula IV; and R9 is a group of formula V.
Inventors:
Masaru Tanaka
Toshihiko Ito
Takao Hirayama
Kazumasa Takeuchi
Toshihiko Ito
Takao Hirayama
Kazumasa Takeuchi
Application Number:
JP16032099A
Publication Date:
December 09, 2009
Filing Date:
June 08, 1999
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
B32B27/34; C08L79/08; C08G73/10; C08K3/20; C08K3/32; C08L9/00; C08L9/02; C08L63/00; C08L83/04; C09J7/02; C09J109/00; C09J109/02; C09J121/00; C09J133/20; C09J179/08; C09J183/04; C09J187/00
Domestic Patent References:
| JP5302033A | ||||
| JP11097578A | ||||
| JP11217503A | ||||
| JP5117616A |