Title:
HEAT-SENSITIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET
Document Type and Number:
Japanese Patent JP2003138237
Kind Code:
A
Abstract:
To provide a heat-sensitive pressure-sensitive adhesive and a heat- sensitive pressure-sensitive adhesive sheet both of which can be easily peeled without imposing such a stress as caused by an energy ray or heat on a substrate or adherend and exhibit a high stickiness at the normal temperature or higher.
Both the heat-sensitive pressure-sensitive adhesive and the heat- sensitive pressure-sensitive adhesive sheet contain a copolymer prepared from (a) 62-68 wt.% alkyl acrylate monomer having a 16C or higher alkyl group, (b) 2-8 wt.% acrylic monomer having a functional group, and (c) 32-38 wt.% vinyl monomer copolymerizable with an alkyl acrylate.
Inventors:
ONIZUKA AKITAKA
KOBAYASHI HIROMASA
TAKAHASHI YOSHIKAZU
KOBAYASHI HIROMASA
TAKAHASHI YOSHIKAZU
Application Number:
JP2001334208A
Publication Date:
May 14, 2003
Filing Date:
October 31, 2001
Export Citation:
Assignee:
PANAC CO LTD
International Classes:
C09J7/00; C09J133/08; (IPC1-7): C09J133/08; C09J7/00
Domestic Patent References:
| JP2000351951A | 2000-12-19 | |||
| JPH10251604A | 1998-09-22 |