To provide a heat-sensitive pressure-sensitive adhesive material that exhibits good pressure-sensitive adhesive properties within a wide temperature range from a low temperature (0C) to a high temperature (40C) even to a rough-surface adherend such as corrugated fiber board, good blocking resistance and good delayed properties.
(1) The heat-sensitive pressure-sensitive adhesive material comprises a support and, formed on one surface thereof, at least a pressure-sensitive adhesive underlayer, an intermediate layer mainly composed of a thermoplastic resin and a plastic spherical hollow particle and a heat-sensitive pressure-sensitive adhesive layer in this order, where the heat-sensitive pressure-sensitive adhesive layer comprises a thermoplastic resin, a tackifier and a thermally meltable substance and the thermally meltable substance comprises at least triphenylphosphine. (2) The heat-sensitive pressure-sensitive adhesive material (1) above further comprises a benzotriazole compound of a specific structure as the thermally meltable substance.
YAMAGUCHI TAKEHITO
SHINPO HITOSHI
MORITA MITSUNOBU
SASAKI TAKAYUKI
| JP2006083196A | 2006-03-30 | |||
| JP2006083222A | 2006-03-30 | |||
| JP2000103969A | 2000-04-11 | |||
| JP2004114559A | 2004-04-15 |