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Patent Searching and Data


Title:
HEAT-SHRINKABLE FILM
Document Type and Number:
Japanese Patent JPH11138726
Kind Code:
A
Abstract:

To provide a heat-shrinkable film which shows a strong bonding force over an object to be packaged and superior shrink properties at a low temperature and heat resistance at a high temperature and further, high heat sealing and environmental hygienic properties, without a decrease in the strength due to an ambient temperature.

A first layer consisting of L-LOPE (a copolymer of ethylene and C8α-olefin) with a density of 0.900-0.930 g/cm3 and MFR of 1.0, a second layer of a polybutylene terephthalate resin (intrinsic viscosity: 8.5) and a third layer of polyethylene resin modified by maleic anhydride are laminated over each other as a three-tier form in the layer thickness ratio 2:1:2. Further, this laminate is biaxially stretched at a stretching magnification of 5×5 and thus the heat-shrinkable film with a thickness of 20 μm is obtained.


Inventors:
YOKOTA TOMOHIRO
KOBAYASHI TAKAAKI
Application Number:
JP30301797A
Publication Date:
May 25, 1999
Filing Date:
November 05, 1997
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
B65D71/08; B32B27/32; B32B27/36; B65D65/40; (IPC1-7): B32B27/36; B32B27/32; B65D65/40; B65D71/08