HEAT-SHRINKABLE POLYSTYRENE RESIN FILM, LABEL USING THE FILM, AND CONTAINER

Title:

HEAT-SHRINKABLE POLYSTYRENE RESIN FILM, LABEL USING THE FILM, AND CONTAINER

Document Type and Number:

Japanese Patent JP2003094575

Kind Code:

A

Abstract:

To provide a heat-shrinkable polystyrene resin film which is useful as a packaging material used in coating of a container, etc., binding, exterior finish, etc., especially a heat-shrinkable polystyrene resin film which has a low shrinkage proper temperature area and excellent applicability to aseptic packing packaging and short-time packaging and is excellent in solvent resistance, a label and a container using the film.

In the heat-shrinkable polystyrene resin film having at least one layer of a polystyrene resin, in the main shrinkage direction, a heat- shrinkage ratio expressed by the rate of change in length before and after treatment of immersing the film in water of 65°C for 10 s is at least 5%, and at least one layer of the film has solvent resistance of 98% or below expressed by a weight reduction ratio before and after treatment of immersing the film in 1,3-dioxolane or ethyl acetate for 30 s and drying.

Inventors:

TAKEGAWA YOSHIAKI
ITO KATSUYA
HAYAKAWA SATOSHI
TAHODA TADASHI
YONEDA SHIGERU
NOSE KATSUHIKO

Application Number:

JP2001293385A

Publication Date:

April 03, 2003

Filing Date:

September 26, 2001

Export Citation:

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Assignee:

TOYO BOSEKI

International Classes:

B65D25/20; B32B7/02; B32B27/30; B65D65/02; B65D65/40; C08J5/18; (IPC1-7): B32B27/30; B32B7/02; B65D25/20; B65D65/02; B65D65/40; C08J5/18

Domestic Patent References:

JPH0732468A	1995-02-03
JPH05111984A	1993-05-07
JPH09272182A	1997-10-21
JP2000000932A	2000-01-07
JPH0720785A	1995-01-24
JP2000094599A	2000-04-04
JPH05320448A	1993-12-03
JP2000233444A	2000-08-29
JPH11188818A	1999-07-13

Attorney, Agent or Firm:

Kichi Toshio Kawa

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