Title:
ヒートシンク及びその製造方法
Document Type and Number:
Japanese Patent JP4815065
Kind Code:
B2
Abstract:
Disclosed herein is a heat sink comprising a substrate of insulating ceramic and, superimposed on its upper surface, a diamond film for disposing an element thereon, which heat sink is excellent in heat radiation characteristics and can be stably used. This heat sink is obtained by providing a substrate of ceramic containing aluminum nitride of high thermal conductivity as a principal component; forming on the substrate a bonding member layer, such as a silicon film which is capable of being bonded with the substrate and a diamond film; and forming a polycrystalline diamond film of high quality on the bonding member layer so that the polycrystalline diamond film is strongly bonded with the substrate via the bonding member layer interposed therebetween in accordance with, for example, the vapor phase method.
Inventors:
Masanobu Higashi
Application Number:
JP2001161882A
Publication Date:
November 16, 2011
Filing Date:
May 30, 2001
Export Citation:
Assignee:
Tokuyama Corporation
International Classes:
C04B37/00; H01L23/373; C04B41/87; C04B41/89; C04B41/90; H01L21/48
Domestic Patent References:
| JP11243168A | ||||
| JP62133068A | ||||
| JP2001244357A | ||||
| JP62254450A | ||||
| JP61261480A | ||||
| JP61240629A |