Title:
HEAT SINK
Document Type and Number:
Japanese Patent JP2004014735
Kind Code:
A
Abstract:
To provide a heat sink which has layer heat emissivity than that of a conventional heat sink made of metal such as aluminum and copper and is free of problems of peeling caused by a difference in the coefficient of thermal expansion from a semiconductor element due to heat generation by the semiconductor element.
The heat sink is formed of a carbon fiber reinforced carbon compound material obtained by aligning and molding a carbon fiber material with high heat conductivity in a thickness direction. Heat conductivity in the thickness direction is ≥500 W/(m K) and in ≥(20:1) proportion to heat conductivity in a plane direction.
Inventors:
HIRAOKA TOSHIJI
OTA NAOTO
OGITA YASUHISA
SHIBATA HIROTAKE
OTA NAOTO
OGITA YASUHISA
SHIBATA HIROTAKE
Application Number:
JP2002165222A
Publication Date:
January 15, 2004
Filing Date:
June 06, 2002
Export Citation:
Assignee:
TOYO TANSO CO
International Classes:
H01L23/36; H01L23/373; (IPC1-7): H01L23/36; H01L23/373
Attorney, Agent or Firm:
Yoshiyuki Kaji
Makoto Suhara
Makoto Suhara
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