HEAT TRANSFER COMPOSITION

Japanese Patent JP2020009974

A

To suppress an electromagnetic wave regardless of a frequency band as to a heat transfer composition.SOLUTION: A heat transfer composition comprises a base material, and a dielectric constant adjustment filler having a dielectric constant lower than that of the base material and/or a high-magnetic permeability filler having a magnetic permeability higher than that of the base material, which is arranged to have a relative magnetic permeability of over one(1) and a specific dielectric constant of 7 or less. The heat transfer composition is arranged so that the relative magnetic permeability is over one(1), which enables the suppression of an RF band electromagnetic wave over about one(1) GHz. In addition, the heat transfer composition is arranged to have a specific dielectric constant of 7 or less and as such, a resonant frequency of a radiator can be shifted to a high frequency side by disposing the heat transfer composition between an electronic component such as IC and the radiator. Therefore, an electromagnetic wave of a relatively low frequency band, especially under one(1) GHz can be suppressed. As described above, the heat transfer composition of the present invention can suppress electromagnetic waves regardless of a frequency band.SELECTED DRAWING: Figure 3

JP2590715	[Name of invention] Radiation noise reduction structure for electronic devices
JP2005017006	SHIELDING STRUCTURE FOR MAGNETICALLY SHIELDED ROOM

MATSUZAKI TORU
KAWAGUCHI YASUHIRO
SAITO MASAHIRO
MITSUYA KENSUKE
ITO MASAAKI
OMORI TOSHIYUKI

JP2018131901A

January 16, 2020

July 11, 2018

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KITAGAWA IND CO LTD
SEIKO EPSON CORP

H05K9/00; C08K3/01; C08L101/00; H01L23/373; H05K7/20

JP2002134984A	2002-05-10
JP2018073897A	2018-05-10
JP2018073912A	2018-05-10
JP2016171113A	2016-09-23
JP2003133784A	2003-05-09
JP2961171B1	1999-10-12

Yasuo Itaya
Shinichi Mizuta
Itaya Masayuki

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