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Title:
HEAT TRANSFER SHEET, HEATING STRUCTURE, HEAT RADIATION STRUCTURE, ELECTRIC EXAMINATION METHOD AND APPARATUS USING THE SAME
Document Type and Number:
Japanese Patent JP2001316502
Kind Code:
A
Abstract:

To obtain a heat transfer sheet having excellent nonadhesion suitable for constructing a heating structure and a heat radiation structure, capable of preventing a body from making an adhesion state between the heat transfer sheet and the body even in the case of contact of the body pressing against the surface of the heat transfer sheet under a high-temperature condition and slightly contaminating the connection surface of the body and to provide the heating structure, the heat radiation structure, an electric examination method and an apparatus using the same.

This heat transfer sheet is characterized by comprising a polymer part and a heat transfer member and having the surface subjected to nonadhesion treatment. This heating structure this heat radiation structure, this electric examination method and this apparatus are obtained by using the heat transfer sheet.


Inventors:
IGARASHI HISAO
HARA TAKEO
Application Number:
JP2000131792A
Publication Date:
November 16, 2001
Filing Date:
April 28, 2000
Export Citation:
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Assignee:
JSR CORP
International Classes:
C08J7/04; C08J7/00; C08K3/00; C08K9/02; C08L101/00; H01L23/36; H01L23/373; H05K7/20; (IPC1-7): C08J7/00; C08J7/04; C08K3/00; C08K9/02; C08L101/00; H01L23/36; H01L23/373; H05K7/20
Domestic Patent References:
JPH04209633A1992-07-31
JPH11302545A1999-11-02
JPS492324B11974-01-19
JPS57145150A1982-09-08
JPS6112077U1986-01-24
JPH1112481A1999-01-19
JPH02115237A1990-04-27