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Title:
HEAT TRANSPORT DEVICE
Document Type and Number:
Japanese Patent JP2004278840
Kind Code:
A
Abstract:

To provide a heat transport device structured so that the passage for heating medium is formed as a microchannel, capable of reducing the pressure loss of the heating medium and reducing the fabrication cost.

The heat transport device is equipped with passages 103-183 admitting flowing of a fluid and structured so as to transport the heat of a heat source 200 from the high temperature side to the low temperature side through the fluid, wherein the microchannel in which the size of the passages 103-183 is made smaller than the other parts is formed in the neighborhood of the heat source in the passages 103-183. In the case of using an aluminum member of tubular shape where a plurality of through holes are formed parallel, the through holes constitute the passages 103-183, and they are compressed by applying an external force to the part in the neighborhood of the heat source so as to form the microchannel. Otherwise one or more tubular members or rod-shaped members, or a metal member having a gap is/are installed in the neighborhood of the heat source in the passages 103-183, whereby the microchannel is formed.


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Inventors:
OBARA KIMIKAZU
NARA KENICHI
INOUE SEIJI
AKIMOTO AKITO
SUGIURA MAKOTO
Application Number:
JP2003067928A
Publication Date:
October 07, 2004
Filing Date:
March 13, 2003
Export Citation:
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Assignee:
DENSO CORP
International Classes:
F28F3/02; H05K7/20; (IPC1-7): F28F3/02; H05K7/20
Attorney, Agent or Firm:
Yoji Ito
Takahiro Miura
Fumihiro Mizuno



 
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