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Title:
HEATER CHIP AND SOLDERING DEVICE
Document Type and Number:
Japanese Patent JP2017112243
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a heater chip capable of surely melting a solder piece as a cut wire solder even when a heat condition is constant.SOLUTION: In a heater chip 45 heated by a resistance heating and used in a soldering device, a solder piece introduction hole 45a arranged by introducing a solder piece 2a as a cut wire solder and a soldered part arrangement hole 45b to which a part of a terminal pin 4a soldered to a land 3a by the melted solder piece 2a is arranged are individually formed. In the heater chip 45, a state where a side surface of the solder piece introduction hole 45a and the solder piece 2a are not contacted due to influence of the terminal pin 4a or a state where a contact area of the side surface of solder piece introduction hole 45a and the solder piece 2a becomes small are prevented, and the contact area of the side surface of solder piece introduction hole 45a and the solder piece 2a can be secured.SELECTED DRAWING: Figure 7

Inventors:
UCHIYAMA TOMOHIRO
YAMASHITA ATSUSHI
MORIYA NAOYA
Application Number:
JP2015245899A
Publication Date:
June 22, 2017
Filing Date:
December 17, 2015
Export Citation:
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Assignee:
NIDEC SANKYO CORP
International Classes:
H05K3/34; B23K1/00; B23K3/02; B23K3/06
Domestic Patent References:
JP2015076496A2015-04-20
JP2012183552A2012-09-27
JPH11245029A1999-09-14
JP2014146630A2014-08-14
JPH0957437A1997-03-04
JP2011165780A2011-08-25
Attorney, Agent or Firm:
Shin Kodaira
Shiro Yokozawa
Toru Kawai
Kawaguchi Nobuko