HEATING DEVICE, ITS MANUFACTURE, AND TREATMENT DEVICE

Title:

HEATING DEVICE, ITS MANUFACTURE, AND TREATMENT DEVICE

Document Type and Number:

Japanese Patent JPH08315965

Kind Code:

A

Abstract:

PURPOSE: To provide a heating device for directly or indirectly heating an object placed on its upper surface in which corrosion resistance is improved, no particle causing contamination is generated, the temperature can be sharply raised and lowered with good heating efficiency, and electricity can be effectively fed from the atmospheric side.

CONSTITUTION: A heating material 31 generating heat by the feed from an AC power source 58 is filled and housed in a heater pattern with a prescribed depth formed on the lower surface of a heating plate 11 formed of transparent quartz, and a quartz reflecting plate 21 is closely bonded to its lower surface. A continuity part 16a of the heating material 31 and a connecting part outer circumference of a feed pin 54 are airtighly sealed by an insulating member 55 through an O-ring 56. Since the vicinity of this connecting part is cooled with cooling water in a coolant passage 51, the function of the O-ring 56 is never lost. Since the heating plate 11 has a large temperature gradient, a semiconductor wafer W to be heated is never influenced by the above cooling.

Inventors:

ARAMI JUNICHI (JP)
ISHIKAWA KENJI (JP)
USHIKAWA HARUNORI (JP)
YANAGISAWA ISAO (JP)
KAWADA NOBUO (JP)
MOGI HIROSHI (JP)

Application Number:

JP27627895A

Publication Date:

November 29, 1996

Filing Date:

September 28, 1995

Export Citation:

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Assignee:

TOKYO ELECTRON LTD (JP)
SHINETSU CHEMICAL CO (JP)

International Classes:

H05B3/14; C23C14/50; C23C16/46; H01L21/205; H01L21/31; H01L21/324; (IPC1-7): H05B3/14; C23C14/50; H01L21/205; H01L21/31; H01L21/324

Attorney, Agent or Firm:

Tetsuo Kanemoto (1 person outside)

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