PURPOSE: To provide an economic high-performance heating device which is used for a thermal reaction furnace, etc., used in a semiconductor manufacturing process and in which heating (heater) element wires can be assembled extremely easily in a short time.
CONSTITUTION: A heating device for thermal reaction furnace is constituted in such a way that the plurality of annular sections of spirally wound heating element wires are supported and fixed by arranging a plurality of element wire supporting shelves 9 each of which can support each annular section in a removable state from the outside in the peripheral direction of the element wires 3. Therefore, an economic highly-reliable heating device can be obtained, because the assembling time of the device can be reduced remarkably and the occurrence of collapsing and run out of control of the element wires 3 due to such a deformation as the expansion, contraction, etc., can be eliminated.
KAIHATSU HIDEKI
YOSHIDA HISASHI
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