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Patent Searching and Data


Title:
発熱システムおよび発熱体
Document Type and Number:
Japanese Patent JP7475322
Kind Code:
B2
Abstract:
The present specification provides a heating system including: a heating unit including a substrate and a heating layer provided on the substrate and including graphene; an electromagnetic wave irradiation unit configured to irradiate at least one region of the heating unit with electromagnetic waves; and a control unit configured to control an operation of the electromagnetic wave irradiation unit, wherein the heating layer emits heat by absorbing the electromagnetic waves.

Inventors:
Byung Hee Hong
Sanmin Kang
Jung Soo Kim
Application Number:
JP2021200036A
Publication Date:
April 26, 2024
Filing Date:
December 09, 2021
Export Citation:
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Assignee:
SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
International Classes:
H05B3/14
Domestic Patent References:
JP2014146478A
JP2014210675A
JP2014012921A
JP2013101808A
JP2016047777A
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mihiro
Tatsuhiko Abe